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Mechanical spindle for cutting machine

Multi-wire cutting is new type of cutting processing method that takes abrasive material into semiconductor processing area for grinding through high-speed reciprocating motion of metal wire, and cuts hard and brittle materials into hundreds of thin sheets at the same time. Compared with other technologies, multi-wire cutting technology has the advantages of high efficiency, high productivity and high precision. It is the most widely used wafer cutting technology.

The spindle group consists of fixed support shaft, dynamic support shaft and guide wheel, the middle with rod connected. It is widely used in domestic solar panel silicon wafer processing enterprises, sapphire chip processing enterprises, wire cutting machine equipment manufacturing enterprises.  


Type

Speed (r/min)

D

L1

L2

L3 ( Length of cutting silicon rod)

175QP02

2000

175

484

282

450

180QP02

2000

180

346

231

350

210QP015

1500

210

442

295

500

217QP025

2500

217

474

440

600

257QP025

2500

257

482

450

800

300QP021

2100

300

485

587

800

310QP012

1200

310

645

510

800